Publications

Ciocci, R., Abu-Mahfouz, I., and Elnashaie, S., “Analysis to Develop Hydrogen Production from Bio-oils,” Proceedings of the 2007 ASME International Mechanical Engineering Congress and Exposition, IMECE2007-43225, Seattle, WA, November 11-15, 2007.

Nie, L., M. Pecht, and R. Ciocci, “Regulations and Market Trends in Lead-free and Halogen-free Electronics,” Circuit World, Vol. 33, No. 2, 4-9, 2007.

Ciocci, R., Massey, D., and Funck, S., “Developing a Process to Identify the Material Flow of a Priority Chemical,” Proceedings of the 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006-13727, Chicago IL, November 5-10, 2006.

Ciocci, R., M. Pecht, and S. Ganesan, Chapter 1 – “Lead-free Electronics: Overview” and Chapter 13 – “Costs to Lead-free Migration” in Lead-free Electronics, edited by S. Ganesan and M. Pecht, IEEE Press, New York: John Wiley & Sons, 2006.

Ciocci, R., “Teaching Sustainable Engineering Ten Years Later: What’s Worked and What’s Next,” American Society for Engineering Education Annual Conference Proceedings, Chicago, IL, June 18-21, 2006.

Cottrell, D., R. Ciocci, and J. Shoup, “Previews of Coming Attractions – Employing the First Year Seminar to Prepare Engineering Freshmen for Success in College and Beyond,” American Society for Engineering Education Annual Conference Proceedings, Chicago, IL, June 18-21, 2006.

Ciocci, R. and M. Pecht, “Learning from the Migration to Lead-free Solder,” Soldering and Surface Mount Technology, Vol. 18, No. 3, 14-18, 2006.

Ciocci, R., “Characterizing Sustainable Mechanical Engineering,” the Technology Interface, Vol. 6, No. 1, 2006, Available: http://technologyinterface.nmsu.edu/Spring06/. 

Ciocci, R. and M. Pecht, “Impact of Environmental Regulations on Green Electronics Manufacture,” Microelectronics International, Vol. 23, No. 2, 45-50, 2006.

Ciocci, R., D. Cottrell, and P. Idowu, “Engineering Technology Graduates Keep Pace with their Engineering Colleagues to Succeed in a Master of Engineering Program,” Journal of Engineering Technology, Vol. 22, No. 2, pp. 46-51, Fall 2005.

Ciocci, R., “Delivering an International Experience to Students in an Intercultural Engineering Course,” Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE2005-82806, Orlando, FL, November 5-11, 2005.

Ciocci, R., “Characterizing Naphthalene via Material Flow Analysis,” Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE2005-82808, Orlando, FL, November 5-11, 2005.

Ciocci, R. and M. Pecht, “Questions Concerning the Migration to Lead-free Solder,” Circuit World, Vol. 30, No. 2, 34-40, 2004.

Ciocci, R., “Reflections from TEC 2004: Sustainable Mechanical Engineering,” Proceedings of the 2004 ASME International Mechanical Engineering Congress and Exposition, Anaheim, CA, November 12-16, 2004. 

Ciocci, R., “Infusion of Sustainability in Engineering and Technology Curricula,” Proceedings of the 2004 Richard Alsina Fulton Conference on Sustainability and the Environment, Wilson College, Chambersburg, PA, pp. 58-67, March 27, 2004.

Ciocci, R., “Engineering and Engineering Technology Program Assessments - DACUM Style,” American Society for Engineering Education Annual Conference Proceedings, Nashville, TN, June 22-25, 2003.

Ciocci, R., J. Wu, and M. Pecht, “Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal,” European Microelectronics Packaging and Interconnection Symposium, Cracow, Poland, pp. 73-80, June 16-18, 2002

Ciocci, R., “DACUM: An Assessment Tool at Harrisburg Area Community College,” Proceedings of the Pennsylvania Association of Two-Year Colleges 59th Annual Conference 2002, Harrisburg, PA, April 10-12, 2002.

Ciocci, R., “Lead-free Solder Replacement: Beyond the Material Substitution,” Proceedings of the International Society of Optical Engineering, Environmentally Conscious Manufacturing II, Volume #4569, Newton, MA, October 28-29, 2001.

Ciocci, R., “Handling the Migration to Lead Free,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 3, 536-538, September 2001.

Ciocci, R., “Lead-free Solder and the Consumer Electronics Market,” Proceedings of the 2001 Green Engineering Conference, Roanoke, VA, July 29-31, 2001.

Ciocci, R., “Assessment of an Engineering and Technology Summer Program for Underrepresented Students,” American Society for Engineering Education Annual Conference Proceedings, Albuquerque, NM, June 24-27, 2001.

Ciocci, R., “Assessment of Environmental Equity: Results of an Engineering Service-Learning Project,” Projects that Matter: Concepts and Models in Service-Learning for Engineering, edited by Edmund Tsang, American Association for Higher Education, Washington, DC, pp. 161-166, 2000.

Godbois, C., R. Ciocci, and E. Leung, "Applied Algebra with Laboratory Experimentation," American Society for Engineering Education Annual Conference Proceedings, Seattle, WA, June 28-July 1, 1998.

Ciocci, R., "Product Reuse and Reliability," American Society for Engineering Education Annual Conference Proceedings, Washington, DC, June 23-26, 1996.

Ciocci, R., "Analysis of Environmental Costs of No-clean Soldering Technologies in Electronics Assembly," 21st Mr. Clean Conference Proceedings, Indianapolis, IN, October 18-20, 1995. 

Ciocci, R., "Life Cycle Analysis of No-clean Soldering Technologies for Printed Wiring Boards and Assemblies," The Institute of Electrical and Electronics Engineers Symposium on Electronics and the Environment Proceedings, Orlando, FL, May 1-3, 1995.

Ciocci, R., "The Role of Solid Modeling in the Two-year Curriculum," American Society for Engineering Education Annual Conference Proceedings, Urbana-Champaign, IL, June 20-24, 1993. 

Ciocci, R., "Development of a CAD/CAM Laboratory," American Society for Engineering Education Annual Conference Proceedings, New Orleans, LA, June 16-19, 1991.

Ciocci, R., and W. Mack, “Piece-Making: A Design Activity in Computer-Integrated Manufacturing," Technology, Innovation & Entrepreneurship for Students, pp. 13-18, March-April 1990.

 

Updated 11 August 2008